China leans on $28T capital markets to fund AI chip race
TL;DR
- Beijing is pushing loss-making AI and chip firms toward its $28 trillion equity and bond markets instead of subsidies.
- CXMT's memory-chip IPO raised about $9.8 billion and its shares jumped 466% on debut, topping mainland China's valuation table.
- Chinese tech firms raised roughly $217 billion over two years via IPOs and bonds, versus about $6 for every $1 in the US.
China is trying to fund its AI and chip build-out the way America funds one, through public equity and corporate debt rather than another round of state grants. A Bloomberg feature describes Beijing marshaling its roughly $28 trillion stock and bond markets to back semiconductor and AI companies, fast-tracking IPOs for strategically important firms and opening more bond channels for them. The shift, Bloomberg says, opens access to the roughly $26 trillion held by Chinese households, the world's largest pool of savings.
The listings themselves are the visible edge of the policy. Memory-chip maker CXMT raised about $9.8 billion on Shanghai's Star board and closed 466% higher on its first day, briefly becoming the most valuable stock in mainland China and eclipsing ICBC. CXMT was the first firm to go through a new 'preliminary review' pilot that let regulators clear key issues before a formal application, taking it from filing to trading in under eight months. GPU designer Moore Threads jumped 425% on its Shanghai debut and now plans a Hong Kong listing 'at an appropriate time,' and testing-equipment maker Semight Instruments rose 876% on its April debut. Bloomberg tallies about $217 billion raised by Chinese tech firms through IPOs and bonds over the past two years, though it notes US peers still raised more than $6 for every $1 Chinese firms secured. This is our third piece in a day on the same listings wave, after CICC's anchor role in the CXMT and Zhongji deals and Apple's reported CXMT DRAM tests.
The part that separates this from an ordinary rally is the plumbing. Bloomberg reports that since 2025 the PBOC, the CSRC and the Ministry of Finance have built a coordinated framework combining bank lending, bond issuance and long-term investment for tech, and that major Chinese tech names are borrowing at an average bond coupon of about 1.9% this year, roughly 300 basis points below US peers. Tech loans reached 22% of new corporate lending in the second quarter, but Bloomberg notes most of that still went to mature companies, because lenders prefer stable cash flows to loss-making R&D. That is why the state is now pushing the equity route so hard.
A few things the piece does not resolve. It does not break out how much of the $217 billion actually funded new fabs or research versus refinancing older debt, and it does not name the specific process nodes CXMT or Moore Threads can produce at scale under US export controls. The framing that this is a decisive 'break' from subsidies is the reporter's, not an official policy statement, and July's tech-stock wobble already forced authorities to intervene to steady prices.
If the pipeline holds, the beneficiaries are the domestic memory and GPU challengers with genuine engineering roadmaps, Hong Kong's exchange as a secondary venue, and the mainland brokerages underwriting the flow. The risk that lingers is the one Beijing has spent a decade trying to avoid, a retail-funded bubble in strategically favored stocks.
Originally reported by bloomberg.com
Read the original article →Original headline: Bloomberg: China Marshals $28T Capital Markets to Fund AI Race, Break From State-Subsidy Playbook