Schneider Electric and Foxconn Announce Strategic Collaboration to Co-Develop Modular Power, Cooling, and Reference Architectures for Next-Generation AI Data Centers

Schneider Electric and Hon Hai Technology Group (Foxconn) announced a strategic partnership to jointly design next-generation AI data center infrastructure, combining Foxconn's AI server manufacturing, rack integration, and compute platform expertise with Schneider's power management, cooling systems, and energy intelligence capabilities. The collaboration targets closed-loop energy optimization, modular power and cooling skids, and standardized reference architectures aimed at enabling faster, more sustainable AI infrastructure deployments across regions, with production of jointly developed solutions expected to begin later in 2026. Schneider CEO Olivier Blum stated that scalable AI requires 'connected' energy management systems, framing the deal around the intensifying power and efficiency constraints of hyperscale AI compute.