CXMT's LPDDR6 lands in Xiaomi 18 Fold ahead of Samsung, SK Hynix

Chinese memory maker ChangXin Memory Technologies has started mass production of LPDDR6 DRAM and will ship the chips first in Xiaomi's next foldable flagship, Reuters reported. Xiaomi confirmed the partnership on its official Weibo account, naming the Xiaomi 18 Fold as the debut device for a September 2026 launch.

The pairing carries a domestic-champion angle on two fronts. CXMT's LPDDR6 sits alongside Xiaomi's in-house Xring O3, a 3-nanometer SoC that Notebookcheck reports runs the memory at 10,667 MT/s — under the 14,400 MT/s LPDDR6 spec ceiling, but on a 24-bit interface wider than LPDDR5X. The Xring O3 itself is manufactured on TSMC's 3nm process. The Xiaomi Pad 9 Pro Max will ship with the same combination.

The step narrows the mobile-DRAM gap with Samsung Electronics and SK Hynix, with Xiaomi claiming a world first for CXMT's LPDDR6 in a shipping phone. The company began mass-producing its previous-generation LPDDR5 chips less than a year ago; it says it has already sampled LPDDR6 to customers in servers and smart vehicles, and Xring O3 shipments are targeted at 200,000 to 300,000 units.

The announcement landed the same day CXMT filed suit against the U.S. Department of Defense over its Chinese Military Company designation. In its first earnings release since going public, the company reported revenue up 874% year-on-year to 150.3 billion yuan ($22.36 billion). CXMT is now a recurring name in the China chip file we track — the Pentagon lawsuit landed alongside this one the same day.