MediaTek Launches First 2nm Smartphone SoC Dimensity 9600 Pro With Agentic AI Engine, 30B On-Device LLM Support

MediaTek unveiled the Dimensity 9600 Pro, its first flagship smartphone SoC built on TSMC's 2nm N2P process, plus a 3nm 9600M variant. The chip's NPU 1090 delivers 51% higher LLM prefill throughput and supports models up to 30B parameters on-device, and its Agentic AI Engine markets 'digital twin' proactive assistance. Multi-core power falls 61% versus its predecessor; commercial devices ship this quarter.