TSMC Q2 2026 Revenue Hits Record NT$1.27 Trillion (~$39.62B), Up 36% YoY and Above Guidance — CoWoS Advanced Packaging Reportedly Sold Out Through End of 2026 With Lead Times Stretching Into 2027 as AI Infrastructure Demand Remains Supply-Constrained

TSMC reported Q2 2026 revenue of NT$1.27 trillion (~$39.62B), up 36% YoY and above its own $39.0–40.2B guidance, with 7nm-and-smaller nodes representing 77% of wafer revenue. Consensus net profit came in near NT$632.6B (~$19.65B), up ~59% YoY. The biggest signal for the AI infrastructure trade: CoWoS advanced packaging capacity is reportedly sold out through year-end with lead times stretching into 2027, framing AI hardware as supply-constrained rather than demand-slowing.