TSMC

Latest: TSMC Pays NT$38.8B for Two AUO Taichung Plants to Convert Into CoWoS Advanced Packaging Capacity · trendforce.com, Oct 30, 2026

Empresa Palavras-chave monitoradas: tsmc, taiwan semiconductor

1 AI Weekly issues and 42 live stories from the last 30 days mention TSMC.

1 menções no total 0/20 edições recentes pico 0/edição monitorado desde 2026-05-26

Tendência de menções: últimas 20 edições

Notícias ao vivo (42)

TSMC Pays NT$38.8B for Two AUO Taichung Plants to Convert Into CoWoS Advanced Packaging Capacity

trendforce.com · 2026-10-30 · Pontuação: 25

TSMC Reportedly Weighs 20% CoWoS Price Hike as Nvidia Blackwell and Rubin Overflow Packaging Capacity

trendforce.com · 2026-10-27 · Pontuação: 22

TechCrunch Mobility: Rivian Builds Own In-Vehicle AI Models and 5nm Autonomy Chip With Arm and TSMC

techcrunch.com · 2026-10-18 · Pontuação: 17

Taiwan to Fund Up to $4B Texas Industrial Park Anchoring Nvidia AI Supply Chain

bloomberg.com · 2026-10-16 · Pontuação: 21

TSMC CEO C.C. Wei Tells Analysts TSMC Must Operate Any Fab in Musk's Terafab Project

bloomberg.com · 2026-10-15 · Pontuação: 27

GlobalFoundries Signs $2B Five-Year Deal With TSMC to Make CoWoS Silicon Interposers in Malta, NY

bloomberg.com · 2026-10-08 · Pontuação: 23

VSMC Opens $7.8B Singapore Fab With Full Capacity Already Sold Out, Second Plant in Planning

asia.nikkei.com · 2026-09-28 · Pontuação: 26

MediaTek Launches First 2nm Smartphone SoC Dimensity 9600 Pro With Agentic AI Engine, 30B On-Device LLM Support

reuters.com · 2026-09-15 · Pontuação: 23

ALERTA Arm Debuts Neoverse CSS N4 'Ranger' With Up to 128 Cores at 3.8GHz on TSMC N3P for Agentic AI Servers

tomshardware.com · 2026-09-08 · Pontuação: 28

Xiaomi Launches TSMC 3nm Xring O3 Phone SoC and 6nm Xring O100 NPU for On-Device MiMo LLM

bloomberg.com · 2026-08-24 · Pontuação: 22

Microsoft Targets September Reveal for Maia 300 Chip, in Talks With TSMC for 300K+ Units in 2027

theinformation.com · 2026-08-10 · Pontuação: 23

TSMC July Sales Jump 45% YoY to NT$467.6B as AI Chip Demand Roars On Through Bubble Jitters

bloomberg.com · 2026-08-10 · Pontuação: 23

Sony and TSMC to Form $6.3B Kumamoto JV for Next-Gen Image Sensor Chips by 2029

asia.nikkei.com · 2026-08-10 · Pontuação: 20

Nikkei: South Korea and Taiwan Each Passed Japan in Total Exports for the First Time in H1 2026, Driven by AI Chip Demand

asia.nikkei.com · 2026-08-07 · Pontuação: 16

Huawei's Chip Scientist Liao Heng Warns Nvidia, TSMC Approaching 'Avalanche' at Transistor Physical Limit, Touts Tau Scaling Law

bloomberg.com · 2026-08-04 · Pontuação: 23

TSMC Pilots CoPoS Rectangular-Panel Packaging to Blunt Intel's EMIB and Break AI-Chip Capacity Ceiling

theinformation.com · 2026-07-30 · Pontuação: 23

China's Shanghai Yuliangsheng Begins Mass-Producing First Domestic Immersion DUV Lithography Tool

theinformation.com · 2026-07-27 · Pontuação: 23

US Lawmakers Press Trump Team to Close Chip Loophole Letting Huawei Buy TSMC and Samsung Silicon

bloomberg.com · 2026-07-23 · Pontuação: 21

ALERTA AMD Launches 256-Core EPYC Venice at Advancing AI 2026, First HPC CPU in Volume on TSMC 2nm With 70% Perf Jump

tomshardware.com · 2026-07-22 · Pontuação: 31

ALERTA TSMC to Raise Chipmaking Prices Up to 10% Starting 2027 as Materials and Overseas Fab Costs Escalate

asia.nikkei.com · 2026-07-21 · Pontuação: 28

ALERTA Taiwan Indicts Former TSMC Deputy Manager for Stealing Chip Trade Secrets to Sell to China, First Case Under National Security Act

asia.nikkei.com · 2026-07-20 · Pontuação: 29

TSMC Q2 2026 Revenue Hits Record NT$1.27 Trillion (~$39.62B), Up 36% YoY and Above Guidance — CoWoS Advanced Packaging Reportedly Sold Out Through End of 2026 With Lead Times Stretching Into 2027 as AI Infrastructure Demand Remains Supply-Constrained

cnbc.com · 2026-07-16 · Pontuação: 23

Cadence Ships AuraStack AI Super Agent — Agentic PCB and Advanced-Packaging Platform Claims 15X Productivity Gain and 2X Time-to-Market, With Nvidia, TSMC, Schneider Electric, Socionext and Forvia Hella as Named Early Users; Forvia Cut Component Placement From 4 Days to 4 Minutes

theregister.com · 2026-07-15 · Pontuação: 26

ASML Plans to Raise EUV System Prices and Hike DUV Systems 10% — TSMC Actively Resisting, per The Information Sources — Coincides With Company's Second Consecutive 2026 Guidance Raise as CEO Fouquet Cites 'Extremely Strong' AI Chip Order Intake

theinformation.com · 2026-07-15 · Pontuação: 22

TYLsemi Raises $43M Early-Stage Round Led by Matter Venture Partners to Build Modular AI Chip Design Platform — Combines Standardized Production Chiplets With Custom Packaging, Targets 50% Cost Cut and Half the Development Time vs. Monolithic Design

siliconangle.com · 2026-07-14 · Pontuação: 18

TSMC June Revenue Jumps 67.9% YoY to NT$442.68B, H1 2026 Sales Up 35.6% to NT$2.40T — Company on Track for $40B+ in 2026 AI Chip Revenue as It Notifies Nvidia, Apple and AMD of 5–10% Price Hikes on 3nm/5nm/7nm

cnbc.com · 2026-07-13 · Pontuação: 21

Bloomberg: EM Fund Managers Rotate Out of $4.4 Trillion AI Trio TSMC, Samsung and SK Hynix — JPMorgan AM and GMO Now Buying Gaming, Energy and a Vietnamese Milk Company for Diversification

bloomberg.com · 2026-07-12 · Pontuação: 20

Broadcom Extends Apple Chip Supply Partnership Through 2031 — Custom ASICs, RF Cellular, Wi-Fi/Bluetooth and Networking Silicon Across Multiple Product Generations; Apple Now ~20% of Broadcom Revenue as TSMC AI Demand Strains Supply

reuters.com · 2026-07-06 · Pontuação: 19

NYT Deep Dive: Advanced Chip Packaging Is Now Almost Entirely Reliant on TSMC's Taiwan Operations — US Efforts to Build Domestic Capacity Face Steep Technical and Geopolitical Hurdles

nytimes.com · 2026-06-26 · Pontuação: 21

TSMC-Fueled AI Frenzy Makes Taiwan the Global Capital of Leveraged Stock Bets as Local Markets Surge 100%-Plus

bloomberg.com · 2026-06-23 · Pontuação: 20

Samsung Sees Rising Advanced Chip Orders From BYD, Google, AMD as AI Demand Strains TSMC Capacity

nikkei.com · 2026-06-17 · Pontuação: 25

TSMC Does Not Rule Out Price Hikes as AI Chip Demand Outstrips Supply — 15% Increases on 3nm Wafers Reported for 2H 2026

thenextweb.com · 2026-06-09 · Pontuação: 23

Asia Tech Stocks Extend Selloff: SoftBank Plunges 7.5%, Seoul's Kospi Drops 8% as Investors Sour on AI-Linked Names

cnbc.com · 2026-06-08 · Pontuação: 23

New 3D Silicon Chip Breakthrough Could Extend Moore's Law for Years

sciencedaily.com · 2026-05-30 · Pontuação: 24

Taiwan Raises 2026 GDP Forecast to 9.64% — Best Export Performance in Five Decades, Driven Entirely by AI Chip Demand

bloomberg.com · 2026-05-29 · Pontuação: 16

Nvidia Discloses $150B Annual Taiwan Supply Chain Spend; Jensen Huang Plans 4,000-Person Taipei Campus by 2030

nikkei.com · 2026-05-27 · Pontuação: 26

AMD Announces $10B+ in Taiwan Ecosystem Investments to Scale Advanced Packaging for Next-Gen AI Infrastructure

Business Insider · 2026-05-21 · Pontuação: 21

JPMorgan Raises Taiwan Bull-Case Taiex Target to 50,000, Names Market 'Most Pure-Play Exposure' to Global AI Buildout

bloomberg.com · 2026-05-15 · Pontuação: 16

Sony Semiconductor Solutions and TSMC Sign MOU for Next-Gen Image Sensor Joint Venture in Kumamoto, Targeting Physical AI, Automotive, and Robotics

technode.com · 2026-05-09 · Pontuação: 22

ALERTA Apple and Intel Reach Preliminary Chip-Making Deal, WSJ Reports; Intel Stock Surges 15%

cnbc.com · 2026-05-08 · Pontuação: 28

Apple in Early Talks With Intel and Samsung to Build US-Made Chips as AI Data Center Demand Strains TSMC Capacity

macrumors.com · 2026-05-05 · Pontuação: 25

Bloomberg: AI boom drowns out Middle East war fears, driving record divergence between Asian markets

Bloomberg · 2026-04-27 · Pontuação: 19

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AI Geopolitics: the autonomous-weapons budget outran the rulebook

2026-05-26 · 1 menções